# General hardware specifications

This topic describes:

- Mechanical specifications

- Host interface

- H.100 compliant interface

- Environment

- Power requirements

## Mechanical specifications

This section presents the mechanical specifications for the AG 2000-BRI board including PCI and H.100 bus connectors.

The AG 2000-BRI board has:

- 64K x 16 of SRAM

- An HMIC, which provides enhanced-compliant MVIP switching

- 4MB of DRAM

- 100 MIPS C549 parts

- NS486SXL-25

TDM bus | Features one complete H.100 bus interface with MVIP-95 enhanced-compliant switching
DSP processing power | Up to four Texas Instruments TMS320VC549GGU-100 DSPs at 100 MIPS each
Microprocessor | One 25 MHz 80486 compatible embedded processor
Board weight | 0.45 lb (.20 kg)
Software | Natural Access for Windows, UNIX, or Red Hat Linux

## Host interface

Feature | Specification
--- | ---
Electrical | PCI bus designed to PCI local bus specification revision 2.1
Mechanical | Designed to the PCI local bus specification revision 2.2 for a long expansion card (physical dimensions 4.2 x 12.283 in)
Bus speed | 33 MHz
Memory | 32K on-board interface memory

## H.100 compliant interface

- Flexible connectivity between line interfaces, DSPs, and H.100 bus.

- Switchable access to any of 4096 H.100 timeslots.

- H.100 clock master or clock slave (software-selectable).

- Compatible with any H.100 or H-MVIP compliant telephony interface.

- H.100 bus termination capability (switch-enabled).

AG 2000-BRI boards are not intended to operate with NMS MVIP-90 boards, since existing NMS MVIP-90 boards are not supported by NMS OAM.

## Environment

Feature | Description
--- | ---
Operating temperature | 0 to 50 degrees C
Storage temperature | -20 to 70 degrees C
Humidity | 5% to 80%, non-condensing

## Power requirements

AG 2000-BRI board | Number of DSPs | +5 volt current
--- | --- | ---
200-2BRI | 2 | 2.0A max 1.0A typical
400-4BRI | 4 | 2.3A max 1.3A typical