# General hardware specifications

This topic describes:

- Mechanical specifications

- H.100 compliant interface

- Host interface

- Environment

- Power requirements

## Mechanical specifications

The AG 2000 board has:

- 64K x 16 of SRAM

- An HMIC, which provides enhanced-compliant MVIP switching

- 2MB of DRAM

- 100 MIPS C549 parts

- NS486SXL-25

TDM bus | Features one complete H.100 bus interface with MVIP-95 enhanced-compliant switching
DSP processing power | Up to four Texas Instruments TMS320VC549GGU-100 DSPs at 100 MIPS each
Microprocessor | One 25 MHz 80486 compatible embedded processor
Board weight | Main board: .40 lb (.18 kg) Daughterboard: .05 lb (.02 kg)
Software | Natural Access

## H.100 compliant interface

- Flexible connectivity between line interfaces, DSPs, and H.100 bus.

- Switchable access to any of 4096 H.100 timeslots.

- H.100 clock master or clock slave (software-selectable).

- Compatible with any H.100 or H-MVIP compliant telephony interface.

- H.100 bus termination capability (switch-enabled)

## Host interface

Feature | Specification
--- | ---
Electrical | PCI bus designed to PCI local bus specification revision 2.1
Mechanical | Designed to the PCI local bus specification revision 2.2 for a long expansion card (physical dimensions 4.2 x 12.283 in)
Bus speed | 33 MHz
Memory | 32 K on-board interface memory

## Environment

Feature | Description
--- | ---
Operating temperature | 0 to 50 degrees C
Storage temperature | -20 to 70 degrees C
Humidity | 5% to 80%, non-condensing

## Power requirements

+12V = 40 mA

-12V = 40 mA