This topic describes:
This section presents the mechanical specifications for the AG 2000-BRI board including PCI and H.100 bus connectors.
The AG 2000-BRI board has:
64K x 16 of SRAM
An HMIC, which provides enhanced-compliant MVIP switching
4MB of DRAM
100 MIPS C549 parts
NS486SXL-25
|
TDM bus |
Features one complete H.100 bus interface with MVIP-95 enhanced-compliant switching |
|
DSP processing power |
Up to four Texas Instruments TMS320VC549GGU-100 DSPs at 100 MIPS each |
|
Microprocessor |
One 25 MHz 80486 compatible embedded processor |
|
Board weight |
0.45 lb (.20 kg) |
|
Software |
Natural Access for Windows, UNIX, or Red Hat Linux |
|
Feature |
Specification |
|---|---|
|
Electrical |
PCI bus designed to PCI local bus specification revision 2.1 |
|
Mechanical |
Designed to the PCI local bus specification revision 2.2 for a long expansion card (physical dimensions 4.2 x 12.283 in) |
|
Bus speed |
33 MHz |
|
Memory |
32K on-board interface memory |
Flexible connectivity between line interfaces, DSPs, and H.100 bus.
Switchable access to any of 4096 H.100 timeslots.
H.100 clock master or clock slave (software-selectable).
Compatible with any H.100 or H-MVIP compliant telephony interface.
H.100 bus termination capability (switch-enabled).
AG 2000-BRI boards are not intended to operate with NMS MVIP-90 boards, since existing NMS MVIP-90 boards are not supported by NMS OAM.
|
Feature |
Description |
|---|---|
|
Operating temperature |
0 to 50 degrees C |
|
Storage temperature |
-20 to 70 degrees C |
|
Humidity |
5% to 80%, non-condensing |
|
AG 2000-BRI board |
Number of DSPs |
+5 volt current |
|---|---|---|
|
200-2BRI |
2 |
2.0A max 1.0A typical |
|
400-4BRI |
4 |
2.3A max 1.3A typical |